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arXiv:2404.13801v1 Announce Type: new
Abstract: Sub-1-nm gate length $MoS_2$ transistors have been experimentally fabricated, but their device performance limit remains elusive. Herein, we explore the performance limits of the sub-1-nm gate length monolayer (ML) $MoS_2$ transistors through ab initio quantum transport simulations. Our simulation results demonstrate that, through appropriate doping and dielectric engineering, the sub-1-nm devices can meet the requirement of extended 'ITRS'(International Technology Roadmap for Semiconductors) $L_g$=0.34 nm. Following device optimization, we achieve impressive maximum on-state current densities of 409 $\mu A / \mu m$ for n-type and 800 $\mu A / \mu m$ for p-type high-performance (HP) devices, while n-type and p-type low-power (LP) devices exhibit maximum on-state current densities of 75 $\mu A / \mu m$ and 187 $\mu A / \mu m$, respectively. We employed the Wentzel-Kramer-Brillouin (WKB) approximation to explain the physical mechanisms of underlap and spacer region optimization on transistor performance. The underlap and spacer regions primarily influence the transport properties of sub-1-nm transistors by respectively altering the width and body factor of the potential barriers. Compared to ML $MoS_2$ transistors with a 1 nm gate length, our sub-1-nm gate length HP and LP ML $MoS_2$ transistors exhibit lower energy-delay products. Hence the sub-1-nm gate length transistors have immense potential for driving the next generation of electronics.